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STP11NK50Z View Datasheet(PDF) - STMicroelectronics

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Description
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STP11NK50Z Datasheet PDF : 16 Pages
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STB11NK50Z - STP11NK50ZFP - STP11NK50Z
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
VDS
VGS
ID
ID
IDM(2)
PTOT
Drain-source voltage (VGS = 0)
Gate-source voltage
Drain current (continuous) at TC = 25 °C
Drain current (continuous) at TC=100 °C
Drain current (pulsed)
Total dissipation at TC = 25 °C
Derating factor
VESD(G-S)
dv/dt(3)
Gate source ESD (HBM-C= 100 pF,
R= 1.5 k)
Peak diode recovery voltage slope
VISO Insulation withstand voltage (DC)
TJ
Operating junction temperature
Tstg
Storage temperature
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD 10 A, di/dt 200 A/µs, VDD V(BR)DSS, Tj TJMAX.
Table 3. Thermal data
Symbol
Parameter
Rthj-case
Rthj-a
Tl
Thermal resistance junction-case max
Thermal resistance junction-ambient max
Maximum lead temperature for soldering
purpose
Table 4. Avalanche characteristics
Symbol
Parameter
IAS
Avalanche current, repetitive or not-
repetitive (pulse width limited by Tj max)
Single pulse avalanche energy
EAS
(starting TJ = 25 °C, ID=IAR, VDD = 50 V)
Value
TO-220
D²PAK
TO-220FP
500
± 30
10
6.3
40
125
1
10(1)
6.3(1)
40(1)
30
0.24
Unit
V
V
A
A
A
W
W/°C
4000
V
4.5
--
2500
V/ns
V
-55 to 150
°C
Value
TO-220
D²PAK
TO-220FP
1
4.2
62.5
Unit
°C/W
°C/W
300
°C
Value
Unit
10
A
190
mJ
3/16
 

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