MBD301 MMBD301LT1
PACKAGE DIMENSIONS
R
SEATING
PLANE
PF
A
B
L
K
XX
D
G
H
V
C
12
N
N
ÉÉÉÉDÉÉÉÉ J
SECTION X–X
CASE 182–02
(TO–226AC)
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND ZONE R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSIONS D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS
UNCONTROLLED IN P AND BEYOND DIM K
MINIMUM.
INCHES
DIM MIN MAX
A 0.175 0.205
B 0.170 0.210
C 0.125 0.165
D 0.016 0.022
F 0.016 0.019
G 0.050 BSC
H 0.100 BSC
J 0.014 0.016
K 0.500 –––
L 0.250 –––
N 0.080 0.105
P ––– 0.050
R 0.115 –––
V 0.135 –––
MILLIMETERS
MIN MAX
4.45 5.21
4.32 5.33
3.18 4.49
0.41 0.56
0.407 0.482
1.27 BSC
3.54 BSC
0.36 0.41
12.70 –––
6.35 –––
2.03 2.66
––– 1.27
2.93 –––
3.43 –––
STYLE 1:
PIN 1. ANODE
2. CATHODE
A
L
3
BS
1
2
V
G
C
D
H
K
J
CASE 318–08
ISSUE AE
SOT–23 (TO–236AB)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
INCHES
DIM MIN MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0350 0.0440
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
J 0.0034 0.0070
K 0.0180 0.0236
L 0.0350 0.0401
S 0.0830 0.0984
V 0.0177 0.0236
MILLIMETERS
MIN MAX
2.80 3.04
1.20 1.40
0.89 1.11
0.37 0.50
1.78 2.04
0.013 0.100
0.085 0.177
0.45 0.60
0.89 1.02
2.10 2.50
0.45 0.60
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
4
Motorola Small–Signal Transistors, FETs and Diodes Device Data