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ISD4002_07 View Datasheet(PDF) - Winbond

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Description
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ISD4002_07 Datasheet PDF : 38 Pages
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ISD4002 SERIES
12.5. DIE INFORMATION
ISD4002 Series
o Die Dimensions [1]
X: 166.6 ± 1 mils
Y: 222.5 ± 1 mils
o Die Thickness [2]
11.5 ± 0.5 mils
o Pad Opening
Single pad opening: 90 x 90 μm
Double pad opening: 180 x 90 μm
VSSD
VSSD
MOSI
MISO
SCLK VCCD
SS VCCD XCLK
INT
RAC
VSSA
ISD4002
VSSA[3]
VSSA[3]
VSSA
AUD
OUT
AM
CAP
ANA
IN-
ANA
VCCA[3]
IN+
VCCA[3]
Notes:
[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2] Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
[3] Double bond is recommended if treated as one single pad.
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