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Part Name :

8002 View Datasheet(PDF) - Unspecified

Part Name8002 ETC
Unspecified 
DescriptionPrototyping Boards (Circbord®)
8002 Datasheet PDF : 5 Pages
1 2 3 4 5
VECTORBORD®
Prototyping Boards (Circbord®)
8004
4.5" x 6.5"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
Ground Plane
• To commit wire-wrap pins to
N/A
6.50"/.062"
4.50"
50
CEM-1
voltage and ground planes, use
Vector T124 solder washers,
available separately
• 0.085" diameter clearance
around holes
• Etched overall ground plane on
T42-1
wiring side only
T44, T46, T49, T68 • Plane surfaces solder-coated
R32
.042"
for user convenience
• I/O area with solder pads for
mounting connector
8007
4.5" x 6.5" • Pad-Per-Hole pattern on
Circuit Pattern:
Pad-Per-Hole/
component side - overall
Ground Plane pattern on
Ground Plane
wiring side
Contacts:
N/A
• To commit wire-wrap pins to
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
6.50"/.062"
4.50"
60
CEM-1
T42-1
ground planes, use Vector T124
solder washers, available
separately
• 0.080" diameter, isolated solder
pad around holes, component
side
Wire-Wrap Terminals:
T44, T46, T49, T68 • Accommodates any type DIP IC
Wire-Wrap Socket Pins: R32
device or discrete component
Hole Diameter:
.042"
• Plane and pad surfaces solder-
coated for user convenience
8008
4.5" x 6.5"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
Pads & Planes
• Unique circuit pattern features
N/A
full voltage and ground planes
6.50"/.062"
on opposite sides with isolated,
4.50"
plated-thru holes
70
• 0.080" diameter, isolated solder
FR4 Epoxy Glass
pad around holes, component
side
T42-1
• Plane surfaces solder-coated
T44, T46, T49, T68 for user convenience
R32
• SMD cap positions for discrete
.042"
decoupling capacitors
3677-6 4.5" x 8.08"
Circuit Pattern:
Contacts:
Width/Thick:
Height:
16-Pin DIP Capacity:
Material:
Solder Terminals:
Wire-Wrap Terminals:
Wire-Wrap Socket Pins:
Hole Diameter:
3-Hole Solder Pad • Etched circuit pattern on wiring
N/A
side only
8.08"/.062"
4.50"
21
CEM-1
T42-1
• 0.080" diameter, isolated solder
pad around holes, both sides
• 3-hole solder pads
(0.028" X 0.080") for
interconnecting multiple
component leads
T44, T46, T49, T68 • Pad and bus surfaces solder-
R32
coated for user convenience
.042"
ELECTRONIC COMPANY
Specifications subject to change without notice.
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Prototyping Boards (Circbord®) VECTORBORD®

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