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STP08CP05(2008) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
STP08CP05
(Rev.:2008)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STP08CP05 Datasheet PDF : 27 Pages
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STP08CP05
3
Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
3.1
Absolute maximum ratings
Table 4. Absolute maximum ratings
Symbol
Parameter
VDD
VO
IO
IGND
fCLK
TOPR
TSTG
Supply voltage IGND
Output voltage
Output current
GND terminal current
Clock frequency
Operating temperature range
Storage temperature range
Value
0 to 7
-0.5 to 20
100
800
50
-40 to +125
-55 to +150
Unit
V
V
mA
mA
MHz
°C
°C
3.2
Thermal data
Table 5. Thermal data
Symbol
Parameter
DIP-16 SO-16 TSSOP-16 TSSOP-16 (1) Unit
(exposed pad)
RthJA Thermal resistance junction-ambient 90 125
140
1. The Exposed-Pad should be soldered to the PBC to realize the thermal benefits
37.5
°C/W
5/27
 

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