datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

JAN1N6641US View Datasheet(PDF) - Microsemi Corporation

Part Name
Description
View to exact match
JAN1N6641US
Microsemi
Microsemi Corporation Microsemi
JAN1N6641US Datasheet PDF : 2 Pages
1 2
• 1N6639US THRU 1N6641US AVAILABLE IN JAN, JANTX, JANTXV AND JANS
PER MIL-PRF-19500/609
• SWITCHING DIODES
• NON-CAVITY GLASS PACKAGE
• METALLURGICALLY BONDED
1N6639US
1N6640US
1N6641US
MAXIMUM RATINGS
Operating Temperature: -65°C to +175°C
Storage Temperature: -65°C to +175°C
Operating Current: 300 mA
Derating: 4.6 mA/°C Above TEC = + 110°C
Surge Current: IFSM = 2.5A, Pw = 8.3ms
ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise speci½ed.
TYPES
1N6639US
1N6640US
1N6641US
V BRR
@ 10 µA
V(pk)
100
75
75
V RWM
V(pk)
75
50
50
I R1
I R2
@ TA = +25°C @ TA = +150°C
VR =
VR =
V RWM
V RWM
T FR
IF
= 200 mA
nA dc
µA dc
ns
100
100
10
100
100
10
100
100
10
T RR
I R = 10 mA
I F = 10 mA
RL = 100
ns
4.0
4.0
5.0
CT
VR = 0
pF
2.5
2.5
3.0
FORWARD VOLTAGE:
TYPES
1N6639US
1N6640US
1N6641US
VF @
VdC
MIN
MAX
IF
mA
(PULSED)
1.20
500
0.54
0.62
1
0.76
0.86
50
0.82
0.92
100
0.87
1.00
200
1.10
200
MILLIMETERS
DIM MIN MAX
D 1.78 2.16
F 0.48 0.71
G 4.19 4.95
S
0.08MIN.
INCHES
MIN MAX
0.070 0.085
0.019 0.028
0.165 0.195
0.003MIN.
FIGURE 1
DESIGN DATA
CASE: D-5D, Hermetically sealed glass
case, per MIL-PRF- 19500/609
LEAD FINISH: Tin / Lead
THERMAL RESISTANCE:
50 °C/W maximum at L = 0
(ROJEC):
THERMAL IMPEDANCE: (ZOJX): 25
°C/W maximum
POLARITY: Cathode end is banded
MOUNTING SURFACE SELECTION:
The Axial Coefficient of Expansion
(COE) of this device is approximately
+ 4PPM / °C. The COE of the Mounting
Surface System should be selected to
provide a suitable match with this
device.
6 LAKE STREET, LAWRENCE, MASSACHUSETTS 01841
PHONE (978) 620-2600
FAX (781) 689-0803
WEBSITE: http://www.microsemi.com
159
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]