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LM317KC View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
LM317KC 3-Terminal Adjustable Regulator TI
Texas Instruments TI
LM317KC Datasheet PDF : 32 Pages
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LM317
SLVS044W – SEPTEMBER 1997 – REVISED OCTOBER 2014
7 Specifications
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7.1 Absolute Maximum Ratings
over virtual junction temperature range (unless otherwise noted)(1)
VI – VO
TJ
Tstg
Input-to-output differential voltage
Operating virtual junction temperature
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Storage temperature range
MIN
MAX UNIT
40 V
150 °C
260 °C
–65
150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
MAX
2500
1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
VO
VI – VO
IO
TJ
Output voltage
Input-to-output differential voltage
Output current
Operating virtual junction temperature
MIN
MAX UNIT
1.25
7V
3
40 V
1.5 A
0
125 °C
7.4 Thermal Information
THERMAL METRIC(1)
DCY
LM317
KCS
KTT
UNIT
4 PINS
4 PINS
4 PINS
RθJA
RθJC(top)
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-case (bottom) thermal resistance
53
19
25.3
30.6
17
18
°C/W
3
1.94
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
4
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