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MBD301G View Datasheet(PDF) - ON Semiconductor

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Description
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MBD301G Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MBD301G,
MMBD301LT1G,
MMBD301LT3G,
SMMBD301LT3G
Silicon Hot-Carrier Diodes
Schottky Barrier Diodes
These devices are designed primarily for highefficiency UHF and
VHF detector applications. They are readily adaptable to many other
fast switching RF and digital applications. They are supplied in an
inexpensive plastic package for lowcost, highvolume consumer
and industrial/commercial requirements. They are also available in a
Surface Mount package.
Features
Extremely Low Minority Carrier Lifetime 15 ps (Typ)
Very Low Capacitance 1.5 pF (Max) @ VR = 15 V
Low Reverse Leakage IR = 13 nAdc (Typ) MBD301, MMBD301
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Current (DC)
Total Device Dissipation
@ TA = 25°C
MBD301G
MMBD301LT1G, MMBD301LT3G,
SMMBD301LT3G
Symbol Value Unit
VR
30
V
IF 200 (Max) mA
PF
MW
280
200
Derate above 25°C
MBD301G
MMBD301LT1G, MMBD301LT3G,
SMMBD301LT3G
mW/°C
2.8
2.0
Operating Junction
Temperature Range
TJ
55 to
°C
+125
Storage Temperature Range
Tstg
55 to
°C
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
30 VOLTS
SILICON HOTCARRIER
DETECTOR AND SWITCHING
DIODES
TO92 2Lead
CASE 182
STYLE 1
SOT23 (TO236)
CASE 318
STYLE 8
TO92
SOT23
2
CATHODE
1
3
ANODE CATHODE
1
ANODE
MARKING DIAGRAMS
MBD
301
AYW G
G
4T M G
G
1
TO92
SOT23
A = Assembly Location
Y = Year
W = Work Week
4T = Device Code (SOT23)
M = Date Code*
G = PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 1994
1
March, 2018 Rev. 9
Publication Order Number:
MBD301/D
 

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