datasheetbank_Logo     Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

C640C109JCG5TA View Datasheet(PDF) - KEMET

Part NameDescriptionManufacturer
C640C109JCG5TA MULTILAYER CERAMIC CAPACITORS/AXIAL & RADIAL LEADED Kemet
KEMET Kemet
C640C109JCG5TA Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
CERAMIC LEADED
PACKAGING INFORMATION
Ceramic Radial
Lead Tape and Reel Packaging
KEMET offers standard reeling of Molded and Conformally
Coated Radial Leaded Ceramic Capacitors for automatic
insertion per EIA specification RS-468. Parts are taped to a
tagboard carrier strip, and wound on a reel as shown in
Figure 1. Kraft paper interleaving is inserted between the
layers of capacitors on the reel. Ammopack is also available,
with the same lead tape configuration and package quantities.
Figure 1
Carrier Strip
KEMET ®
12"
.059" to .315"
(30.48 cm)
*
Greater Than
Over All
Height
of Taped
Components
Adhesive Tape
Hub
KEMET ®
.655" ±0.010"
(16.6 ±0.25)
Figure 3: Standard Reel
C315*
C320*
C330**
C340**
C6xx#
31/4"
(82.6)
C056**
C066**
1/8"
(3.18)
CK06**
CKR06**
C062**
Carrier Tape
CK05**
CKR05**
C052**
C317**
C322**
C323**
P2
P
C6xx#
C333**
Kraft Paper
Interleaving
(Note: Non-standard lead lengths
available in bulk only.)
H
H1 D0
H
P1
H0
1MM Max.
(.039")
W2
W0 W
Tape
L1
W2
Carrier
F
T
Figure 2: Lead Tape Configuration (See Table Below)
* Lead spacings are 2.54mm
P0
(.10") center-to-center.
** Lead spacings are 5.08mm
(.20") center-to-center.
# See page 15 for exact lead
configuration for Series.
Ceramic Radial Tape and Reel Dimensions in Millimeters & (Inches)
Dimension
Sprocket Hole Diameter
Sprocket Hole Pitch
Symbol
Do
P0
Nominal
mm (inch)
4.0 (.157)
12.7 (.500)
Tolerance
mm (inch)
± 0.2 (.008)
± 0.3 (.012)
Dimension
Symbol
Nominal
mm (inch)
Tolerance
mm (inch)
Height to Seating
H0
Plane (formed leads) (2)
Component Alignment h
7301 7303
7301 7303
16.0 (.630) 18.0 (.709) ±0.5 (.020) Minimum
4.0 (.157)
±0.2 (.008)
Component Pitch
P
12.7 (.500)
± 0.3 (.012)
Lead Protrusion
L1
1.0 (.039)
Maximum
Lead Spacing (1)
Sprocket Hole Center
to Lead Center (1)
Sprocket Hole Center
to Component Center
Height to Seating Plane
(straight leads) (2)
Component Height
Above Tape Center
F
5.08
2.54
+0.6 -0.2
Composite Tape
t
(.20) (.10)
(+.024 -.008)
Thickness
P1
3.81
5.08
± 0.7 (.028)
Overall Tape and
T
(.150) (.200)
Lead Thickness
P2
6.35 (.250)
± 1.3 (.051)
Carrier Tape Width
W
H
7301
7303
7301 7303 Hold-Down Tape
W0
16.0 (.630) 18.0 (.709) ±0.5 (.020) Minimum Width
H1
32.2 (1.27)
Maximum
Hold-Down Tape
W2
Location
(1) Measured at the egress from the carrier tape, on the component side.
(2) Determined by a 4 digit suffix placed at the end of the part number, as follows:
7301 = Recommended for parts with formed leads.
Example: C322C104K5R5CA7301
7303 = Recommended for parts with straight leads.
Example: C320C104K5R5CA7303
0.7 (.051)
1.5 (.059)
18.0 (.709)
5.0 (.197)
3.0 (.118)
±0.2 (.008)
Maximum
+1.0 - 0.5
(+.039 -.020)
Minimum
Maximum
40
© KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Direct download click here

 

Share Link : 

All Rights Reserved © datasheetbank.com 2014 - 2020 [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]