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E-L6210 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
E-L6210
ST-Microelectronics
STMicroelectronics ST-Microelectronics
E-L6210 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
L6210
3
Mounting instructions
Mounting instructions
The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper
area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4).
During soldering the pin temperature must not exceed 260°C and the soldering time must
not be longer then 12 s. The external heatsink or printed circuit copper area must be
connected to electrical ground.
Figure 3. Example of PC board copper area which is used as heatsink
Figure 4. Example of an external heatsink
5/8
 

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