STA335ML View Datasheet(PDF) - STMicroelectronics

Part Name

Description

View to exact match

STA335ML

2-channel microless high-efficiency digital audio system Sound Terminal®

STMicroelectronics 

Package thermal characteristics

6

Package thermal characteristics

STA335ML

Using a double layer PCB the thermal resistance junction to ambient with 2 copper ground

areas of 3 x 3 cm2 and with 16 via holes (see Figure 14) is 24 °C/W in natural air convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

The max estimated dissipated power for the STA335ML is:

2 x 20 W into 8 Ω, at 18 V

Pd max is approximately 4 W

Figure 14. Double layer PCB with 2 copper ground areas and 16 via holes

Figure 15 shows the power derating curve for the PowerSSO-36 package on a board with

two copper areas of 2 x 2 cm2 and 3 x 3 cm2.

Figure 15. PowerSSO-36 power derating curve

Pd (W) 8

7

6

5

4

3

2

1

0

0

Copper Area 3x3 cm

and via holes

Copper Area 2x2 cm

and via holes

STSAT3A3353M3MBLWL

PoPwSeSrOS3S6O-36

20 40 60 80 100 120 140 160

Tamb ( °C)

16/20

Doc ID 17638 Rev 4

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