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STA51813TR View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
STA51813TR
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STA51813TR Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
STA518
6
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 19. PSSO36 (Slug Up) Mechanical Data & Package Dimensions
DIM.
MIN.
mm
TYP. MAX. MIN.
inch
TYP. MAX.
A 2.15
2.47 0.084
0.097
A2 2.15
2.40 0.084
0.094
a1
0
0.075 0
0.003
b 0.18
0.36 0.007
0.014
c 0.23
0.32 0.009
0.012
D (1) 10.10
10.50 0.398
0.413
E (1) 7.4
7.6 0.291
0.299
e
0.50
0.020
e3
8.50
0.035
F
2.3
0.090
G
0.10
0.004
G1
0.06
0.002
H 10.10
10.50 0.398
0.413
h
0.40
0.016
L 0.55
0.85 0.022
0.033
M
4.3
0.169
N
10˚ (max)
O
1.2
0.047
Q
0.8
0.031
S
2.9
0.114
T
3.65
0.144
U
1.0
0.039
X 4.10
4.70 0.161
0.185
Y 6.50
7.10 0.256
0.279
(1) “D and E” do not include mold flash or protusions.
Mold flash or protusions shall not exceed 0.15mm (0.006”)
(2) No intrusion allowed inwards the leads.
(3) Flash or bleeds on exposed die pad shall not exceed 0.4 mm
per side
OUTLINE AND
MECHANICAL DATA
PowerSSO-36
(slug-up)
7618147 A
17/19
 

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