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ST1355-BW2 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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ST1355-BW2 Datasheet PDF : 3 Pages
1 2 3
ST1335, ST1336, ST1355
card is unexpectedly extracted, while an operation
is underway, in an open reader.
EXTERNAL COMMANDS
The device uses five contacts: VCC, GND, I/O,
CLK, RST. Four commands distinct can be
composed using these external pins:
– RESET: to reset the internal address register to
000d
– READ: to increment the internal address
register and read the data bit at the new address
– COMPARE: to allow comparison of the
presented code against the internal transport
code
– PROGRAM: to program the bit at the current
address
CONFIGURATIONS
The device works in two distinct configurations:
– Issuer Configuration: for the card manufacturer.
Customized data can be written to the chip, to
initialize it before release to the end user.
– User Configuration: for use by the end user of
the card, but with restricted access.
OPTIONS
Three options can be chosen on ordering the
device:
– The anti-tearing mechanism can be
disconnected. In this case, the anti-tearing flag
area from bit 288d to bit 319d is unused (Figure
2).
– The user area, from bit 320d to bit 375d, can be
defined as “not erasable” in the User
Configuration.
– The reload mechanism can be activated. In this
case, erasing a bit in the reload counter
refreshes the certificate (CER). At this time, the
certificate can be programmed with a new
value.
ORDERING INFORMATION
The notation used for the device number is as
shown in Table 2. For a list of available options
(speed, package, etc.) or for further information on
any aspect of this device, please contact your
nearest ST Sales Office.
Table 2. Ordering Information Scheme
Example:
ST1335 – C
W4 /
XX YY
Product
35 Active Authentication Function
36 Issuer Area
55 Cipher Block Chaining
Authentication Function
Transport Code
Given by ST
Customer Code
Given by the Issuer
Fuse Blow Voltage
B
6 V1
C
5 V1
Note: 1. Please contact your nearest ST Sales Office to check on availability
Delivery Form
D10 Micromodule on reel
D15 Micromodule on reel
W4 Wafer (180 µm thickness)
W2 Wafer (280 µm thickness)
3/3
 

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