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M93C46-MN6TG View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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M93C46-MN6TG Datasheet PDF : 37 Pages
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M93C86, M93C76, M93C66, M93C56, M93C46
Package mechanical data
Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
D
e
b
L3
L1
E
E2
A
A1
L
D2
ddd
UFDFPN-01
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 26.
Symbol
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
millimeters
inches(1)
Typ
Min
Max
Typ
Min
Max
A
0.55
0.45
0.6
0.0217
0.0177
0.0236
A1
0.02
0
0.05
0.0008
0
0.002
b
0.25
0.2
0.3
0.0098
0.0079
0.0118
D
2
1.9
2.1
0.0787
0.0748
0.0827
D2
1.6
1.5
1.7
0.063
0.0591
0.0669
E
3
2.9
3.1
0.1181
0.1142
0.122
E2
0.2
0.1
0.3
0.0079
0.0039
0.0118
e
0.5
-
-
0.0197
-
-
L
0.45
0.4
0.5
0.0177
0.0157
0.0197
L1
0.15
0.0059
L3
ddd(2)
0.3
0.08
0.0118
0.08
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
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