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HMA121FR4V View Datasheet(PDF) - Fairchild Semiconductor

Part NameDescriptionManufacturer
HMA121FR4V FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS Fairchild
Fairchild Semiconductor Fairchild
HMA121FR4V Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
FULL PITCH MINI-FLAT PACKAGE
4-PIN OPTOCOUPLERS
HMA121 Series HMA124
HMA2701 Series
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.310 (7.87)
0.190 (4.83)
HMAA2705
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
180°C
(heating)
to 30 s
230°C (peak temperature)
210°C
to 60 s
150 s
90 s
60 s
Time (s)
Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
Time of temperature higher than 210°C: 60 seconds or less
One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 9 of 10
11/12/03
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