HC49US-BB0318-20.000 View Datasheet(PDF) - ILSI America LLC

Part Name

Description

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HC49US-BB0318-20.000

2 Lead Metal Package Quartz Crystal, 4.7 mm x 11 mm

ILSI America LLC 

2 Lead Metal Package Quartz Crystal, 4.7 mm x 11 mm

Pb Free Solder Reflow Profile:

HC49US Series

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 1

Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal).

Environmental Specifications

Thermal Shock

Moisture Resistance

Mechanical Shock

Mechanical Vibration

Resistance to Soldering Heat

Hazardous Substance

Solderability

Terminal Strength

Gross Leak

Fine Leak

Solvent Resistance

Marking

MIL-STD-883, Method 1011, Condition A

MIL-STD-883, Method 1004

MIL-STD-883, Method 2002, Condition B

MIL-STD-883, Method 2007, Condition A

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Pb-Free / RoHS / Green Compliant

JESD22-B102-D Method 2 (Preconditioning E)

MIL-STD-883, Method 2004, Test Condition D

MIL-STD-883, Method 1014, Condition C

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

MIL-STD-202, Method 215

Line 1 ILSI, Frequency, Date Code (yww)

06/09_A

ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com

Specifications subject to change without notice

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