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D10/CRCW0402-P View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
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D10/CRCW0402-P Datasheet PDF : 6 Pages
1 2 3 4 5 6
www.vishay.com
D/CRCW-P e3
Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-160068-2
CLAUSE
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
4.25.1
4.18.2
4.35
4.24
4.25.3
4.40
4.29
4.30
4.22
4.37
4.27
-
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
Climatic sequence:
Dry heat
Damp heat, cyclic
Cold
Low air pressure
Damp heat, cyclic
DC load
-
Endurance at 70 °C
58 (Td)
Resistance to
soldering heat
-
Flamability,
needle flame test
78 (Cab)
Damp heat,
steady state
-
-
45 (XA)
Endurance at
upper category
temperature
Electrostatic
discharge
(human body model)
Component solvent
resistance
45 (XA)
Solvent resistance
of marking
6 (Fc)
Vibration, endurance
by sweeping
-
Periodic electric
overload
Single pulse high
-
voltage overload,
10 μs/700 μs
D/CRCW-P e3
-
125 °C; 16 h
55 °C; 90 % RH;
24 h; 1 cycle
- 55 °C; 2 h
1 kPa; (25 ± 10) °C; 1 h
55 °C; 90 % RH;
24 h; 5 cycles
U = P70 x R
U = P70 x R Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
IEC 60695-11-5;
10 s
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
155 °C, 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD voltage acc. to size
Isopropyl alcohol;
50 °C; method 2
Isopropyl alcohol;
50 °C; method 1,
toothbrush
f = 10 Hz to 2000 Hz;
x, y, z 1.5 mm;
A 200 m/s2;
10 sweeps per axis
U = 15 x P70 x R
2 x Umax.;
0.1 s on; 2.5 s off;
1000 cycles
Û = 10 x P70 x R
2 x Umax.;
10 pulses
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
1 to 10 M
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (2 % R + 0.05 )
± (0.25 % R + 0.05 )
No burning after 30 s
± (1 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
No visible damage
Marking legible,
no visible damage
± (0.25 % R + 0.05 )
± (1 % R + 0.05 )
± (1 % R + 0.05 )
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 03-Apr-13
5
Document Number: 20036
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 

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