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BD136-10 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
BD136-10
ST-Microelectronics
STMicroelectronics ST-Microelectronics
BD136-10 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package mechanical data
3
Package mechanical data
BD135 - BD136 - BD139 - BD140
In order to meet environmental requirements, ST offers these devices in ECOPACKĀ®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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