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M24128-BFCSTP/K View Datasheet(PDF) - STMicroelectronics

Part Name
Description
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M24128-BFCSTP/K
ST-Microelectronics
STMicroelectronics ST-Microelectronics
M24128-BFCSTP/K Datasheet PDF : 46 Pages
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M24128-BW M24128-BR M24128-BF M24128-DF
Package information
9.2
UFDFPN8 (DFN8) package information
Figure 18. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch
dual flat package, no lead - package outline

3LQ,'PDUNLQJ
Ğ
ď
WŝŶϭ

<
>

ĞĞĞ
=:B0(H9
1. Drawing is not to scale.
2.
The
(not
central pad
connected)
(the area E2 by D2 in the
in the end application.
above
illustration)
must
be
either
connected
to
VSS
or
left
floating
Table 19. UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,
no lead - package mechanical data
Symbol
millimeters
Min
Typ
Max
inches(1)
Min
Typ
Max
A
0.450
0.550
0.600
0.0177
0.0217
0.0236
A1
0.000
0.020
0.050
0.0000
0.0008
0.0020
b
0.200
0.250
0.300
0.0079
0.0098
0.0118
D
1.900
2.000
2.100
0.0748
0.0787
0.0827
D2
1.200
-
1.600
0.0472
-
0.0630
E
2.900
3.000
3.100
0.1142
0.1181
0.1220
E2
1.200
-
1.600
0.0472
-
0.0630
e
-
0.500
-
-
0.0197
-
K
0.300
-
-
0.0118
-
-
L
0.300
-
0.500
0.0118
-
0.0197
L1
-
-
0.150
-
-
0.0059
L3
0.300
-
-
0.0118
-
-
eee(2)
0.080
-
-
0.0031
-
-
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
DocID16892 Rev 30
35/46
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