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ADSP-BF531 View Datasheet(PDF) - Analog Devices

Part Name
Description
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ADSP-BF531
ADI
Analog Devices ADI
ADSP-BF531 Datasheet PDF : 60 Pages
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ADSP-BF531/ADSP-BF532/ADSP-BF533
18
16
14
RISE TIME
12
10
FALL TIME
8
6
4
2
0
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 55. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT = 2.25 V
14
12
RISE TIME
10
8
FALL TIME
6
4
2
0
0
50
100
150
200
250
LOAD CAPACITANCE (pF)
Figure 56. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at VDDEXT = 3.65 V
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
TJ = TCASE + JT × PD)
where:
TJ = junction temperature (C).
TCASE = case temperature (C) measured by customer at top
center of package.
ΨJT = from Table 31 through Table 33.
PD = power dissipation (see Power Dissipation on Page 45 for
the method to calculate PD).
Values of θJA are provided for package comparison and printed
circuit board design considerations. θJA can be used for a first
order approximation of TJ by the equation:
TJ = TA + JA × PD)
where:
TA = ambient temperature (C).
In Table 31 through Table 33, airflow measurements comply
with JEDEC standards JESD51–2 and JESD51–6, and the junc­
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
Thermal resistance θJA in Table 31 through Table 33 is the figure
of merit relating to performance of the package and board in a
convective environment. θJMA represents the thermal resistance
under two conditions of airflow. ΨJT represents the correlation
between TJ and TCASE.
Table 31. Thermal Characteristics for BC-160 Package
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
27.1
23.85
22.7
7.26
0.14
0.26
0.35
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
Table 32. Thermal Characteristics for ST-176-1 Package
Parameter
θJA
θJMA
θJMA
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
34.9
33.0
32.0
0.50
0.75
1.00
Unit
C/W
C/W
C/W
C/W
C/W
C/W
Table 33. Thermal Characteristics for B-169 Package
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJT
ΨJT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
22.8
20.3
19.3
10.39
0.59
0.88
1.37
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
Rev. E | Page 48 of 60 | July 2007
 

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