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AD5313R View Datasheet(PDF) - Analog Devices

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AD5313R Datasheet PDF : 28 Pages
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Data Sheet
AD5313R
APPLICATIONS INFORMATION
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5313R is achieved via a
serial bus using a standard protocol that is compatible with DSP
processors and microcontrollers. The communications channel
requires a 3-wire or 4-wire interface consisting of a clock signal,
a data signal, and a synchronization signal. The device requires
a 24-bit data-word with data valid on the rising edge of SYNC.
AD5313R TO ADSP-BF531 INTERFACE
The SPI interface of the AD5313R is designed to be easily
connected to industry-standard DSPs and microcontrollers.
Figure 48 shows the AD5313R connected to an Analog Devices
Blackfin® DSP. The Blackfin has an integrated SPI port that can
be connected directly to the SPI pins of the AD5313R.
AD5313R
In systems where there are many devices on one board, it is
often useful to provide some heat sinking capability to allow
the power to dissipate easily.
The AD5313R has an exposed paddle beneath the device.
Connect this paddle to the GND supply for the part. For
optimum performance, use special considerations to design the
motherboard and to mount the package. For enhanced thermal,
electrical, and board level performance, solder the exposed paddle
on the bottom of the package to the corresponding thermal land
paddle on the PCB. Design thermal vias into the PCB land paddle
area to further improve heat dissipation.
The GND plane on the device can be increased (as shown in
Figure 50) to provide a natural heat sinking effect.
AD5313R
ADSP-BF531
SPISELx
SCK
MOSI
PF9
PF8
SYNC
SCLK
SDIN
LDAC
RESET
Figure 48. AD5313R to ADSP-BF531 Interface
AD5313R TO SPORT INTERFACE
The Analog Devices ADSP-BF527 has one SPORT serial port.
Figure 49 shows how one SPORT interface can be used to
control the AD5313R.
AD5313R
ADSP-BF527
SPORT_TFS
SPORT_TSCK
SPORT_DTO
GPIO0
GPIO1
SYNC
SCLK
SDIN
LDAC
RESET
Figure 49. AD5313R to SPORT Interface
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful considera-
tion of the power supply and ground return layout helps to ensure
the rated performance. Design the PCB on which the AD5313R
is mounted such that the AD5313R lies on the analog plane.
Provide the AD5313R with ample supply bypassing of 10 µF in
parallel with 0.1 µF on each supply, located as close to the package
as possible, ideally right up against the device. The 10 µF capa-
citors are of the tantalum bead type. Use a 0.1 µF capacitor with
low effective series resistance (ESR) and low effective series
inductance (ESI), such as the common ceramic types, which
provide a low impedance path to ground at high frequencies to
handle transient currents due to internal logic switching.
GND
PLANE
BOARD
Figure 50. Paddle Connection to Board
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur. The
iCoupler® products from Analog Devices provide voltage isolation
in excess of 2.5 kV. The serial loading structure of the AD5313R
makes the part ideal for isolated interfaces because the number of
interface lines is kept to a minimum. Figure 51 shows a 4-channel
isolated interface to the AD5313R using an ADuM1400. For
more information, visit http://www.analog.com/icouplers.
CONTROLLER
SERIAL VIA
CLOCK IN
ADuM14001
ENCODE
DECODE
VOA TO
SCLK
SERIAL VIB
DATA OUT
ENCODE
DECODE
VOB TO
SDIN
VIC
SYNC OUT
ENCODE
DECODE
VOC TO
SYNC
LOAD DAC VID
OUT
ENCODE
DECODE
VOD TO
LDAC
1ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 51. Isolated Interface
Rev. 0 | Page 25 of 28
 

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