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74LVTH16244BBQ View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
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74LVTH16244BBQ
NXP
NXP Semiconductors. NXP
74LVTH16244BBQ Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
NXP Semiconductors
74LVT16244B; 74LVTH16244B
3.3 V 16-bit buffer/driver; 3-state
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
D
y
Z
48
c
25
E
A
X
HE
vM A
pin 1 index
1
e
A2
A1
24
wM
bp
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT362-1
REFERENCES
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT362-1 (TSSOP48)
74LVT_LVTH16244B_6
Product data sheet
Rev. 06 — 13 November 2008
© NXP B.V. 2008. All rights reserved.
12 of 17
 

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