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74LVT374SJX View Datasheet(PDF) - Fairchild Semiconductor

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Description
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74LVT374SJX Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Physical Dimensions (Continued)
Figure 3. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1999 Fairchild Semiconductor Corporation
74LVT374, 74LVTH374 Rev. 1.5.0
9
www.fairchildsemi.com
 

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