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MIC707(2014) View Datasheet(PDF) - Micrel

Part Name
Description
View to exact match
MIC707
(Rev.:2014)
Micrel
Micrel Micrel
MIC707 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Micrel, Inc.
MIC705/706/707/708
Absolute Maximum Ratings(1)
Terminal Voltage
VCC ....................................................... 0.3V to +6.0V
All Other Inputs. ........................... 0.3V to (VCC + 0.3V)
Input Current
VCC, GND ............................................................ 25mA
Output Current (All) ..................................................... 20mA
Lead Temperature (soldering, 10s)............................ 300°C
Storage Temperature (TS) ......................... 65°C to +150°C
Operating Ratings(2)
Operating Temperature Range ................... –40°C to +85°C
Power Dissipation (SOP) ......................................... 400mW
Thermal Resistance
8-Pin SOIC.......................................................150°C/W
Electrical Characteristics(3)
VCC = 4.75V to 5.5V for MIC705/707; VCC = 4.5V to 5.5V for MIC706/708; TA = Operating Temperature Range,
bold values indicate –40°C TA +85°C, unless noted.
Parameter
Condition
Min.
Typ.
Operating Voltage Range
1.4
Supply Current
Reset Voltage Threshold
MIC705, MIC707
MIC706, MIC708
4.50
4.65
4.25
4.4
Reset Threshold Hysteresis
40
Reset Pulse Width (tRS)
/RESET Output Voltage
RESET Output Voltage
Watchdog Timeout Period (tWD)
WDI Minimum Input Pulse (tWP)
WDI Threshold Voltage
WDI Input Current
WDO Output Voltage
/MR Pull-Up Current
ISOURCE = 800µA
ISINK = 3.2mA
ISOURCE = 800µA
ISINK = 1.2mA
VIL = 0.4V, VIH = 80% of VCC
VIH, VCC = 5V
VIL, VCC = 5V
WDI = 0V
WDI = VCC
ISOURCE = 800µA
ISINK = 1.2mA
/MR = 0V
140
200
VCC 1.5V
VCC 1.5V
1.0
1.6
50
3.5
150
50
50
VCC 1.5V
100
250
Notes:
1. Exceeding the absolute maximum ratings may damage the device.
2. The device is not guaranteed to function outside its operating ratings.
3. Specification for packaged product only
Max.
5.5
60
4.75
4.5
280
0.4
0.4
2.25
0.8
150
0.4
600
Units
V
µA
V
mV
ms
V
V
s
ns
V
µA
V
µA
September 15, 2014
4
Revision 2.1
 

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