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NE5550979A-T1 View Datasheet(PDF) - Renesas Electronics

Part Name
Description
View to exact match
NE5550979A-T1
Renesas
Renesas Electronics Renesas
NE5550979A-T1 Datasheet PDF : 13 Pages
First Prev 11 12 13
NE5550979A
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350°C or below
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2% (Wt.) or below
Condition Symbol
IR260
WS260
HS350
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0031EJ0300 Rev.3.00
Mar 12, 2013
Page 11 of 11
 

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