CB35000 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
View to exact match
CB35000 Datasheet PDF : 16 Pages
| |||
CB35000 SERIES
PACKAGE AVAILABILITY
The CB35000 Series is designed to be
compatible with QFP, BGA and SBC package
types, in addition to the more traditional types
found.
The options include Plastic Leaded Chip Carriers
(PLCC) from 28 to 84 pins, while the Metric Quad
Flat Pack (xQFP) offering ranges up to 208 pins.
Both high performance and high power variants
are available as well as the TQFP thin types.
Figure 6
Packaging Capability
Ball Grid Array (BGA) packages are available
from 160 to 500 pins and SBC types allow the pin
count to reach the area of 1000 pins. Pin counts
for through board mounting (PGA) range up to
480.
The diversity in pin count and package style gives
the designer the opportunity to find the best
compromise for system size, cost and
performance requirements.
All packages for the military market are
hermetically sealed to meet MIL-STD-883
Method. Prototypes are developed in ceramic
packages for fast turnaround evaluation.
NUMBER
OF LEADS
(Pins)
PQFP
TQFP
20
28
44
r
64
r
r
68
80
r
r
84
100
r
r
120
r
128
r
144
r
r
160
r
176
r
180
208
r
224
225
256
257
304
313
400
480
r Packages in Production
A Packages in Development
PACKAGE NAME
BGA
PLCC
r
r
r
r
r
r
r
A
A
A
®
CPGA
r
r
r
r
r
r
r
r
r
A
A
A
POWER PQFP
Slug/Spreader
r
r
r
r
r
9/16
|
|
Share Link: 