NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
2.400 pa + oa
2.000
0.500
0.250
0.500
0.025
0.025
4.250
3.400
pa + oa
0.900
2.000 4.000
solder lands
solder paste
placement area
occupied area
Dimensions in mm
sot996-2_fr
Fig 29. PCB footprint for SOT996-2 (XSON8U); reflow soldering
LM75B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6.1 — 6 February 2015
© NXP B.V. 2015. All rights reserved.
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