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BZX284-C56 View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
BZX284-C56
NXP
NXP Semiconductors. NXP
BZX284-C56 Datasheet PDF : 12 Pages
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Philips Semiconductors
Voltage regulator diodes
Product specification
BZX284 series
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth j-a
thermal resistance from junction to ambient note 1
Note
1. Device mounted on a printed-circuit board: 11 × 25 × 1.6 mm.
VALUE
315
UNIT
K/W
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.2).
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.3).
3.00
,,,,,,,,,, handbook, halfpage
1.25
1.00
1.00
MGC119
Dimensions in mm.
Fig.2 SOD110 reflow soldering pattern.
,,,, ,,,,,, handbook,halfpage
3.40
1.25
1.10
1.10 MGC126
Dimensions in mm.
Fig.3 SOD110 wave soldering pattern.
1999 Apr 19
6
 

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