0805Z104M160NXT View Datasheet(PDF) - Unspecified

Part Name

Description

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0805Z104M160NXT

CERAMIC MULTILAYER CAPACITORS

Unspecified 

BOARD DESIGN CONSIDERATIONS

The amount of solder applied to the chip capacitor will influence the reliability of the

device. Excessive solder can create thermal and tensile stresses on the component

which could lead to fracturing of the chip or the solder joint itself. Insufficient or

uneven solder application can result in weak bonds, rotation of the device off line or lift-

ing of one terminal off the pad (tombstoning).

The volume of solder is process and board pad size dependent. WAVE SOLDERING exposes the

devices to a large solder volume, hence the pad size area must be restricted to accept an amount of solder which is not detrimental to

the chip size utilized. Typically the pad width is 66% of the component width, and the length is .030” (.760 mm) longer than the termi-

nation band on the chip. An 0805 chip which is .050” wide and has a .020” termination band therefore requires a pad .033” wide by

.050” in length. Opposing pads should be identical in size to preclude uneven solder fillets and mismatched surface tension forces which

can misalign the device. It is preferred that the pad layout results in alignment of the long axis of the chips at right angles to the solder

wave, to promote even wetting of all terminals. Orientation of components in line with the board travel direction may require dual

waves with solder turbulence to preclude cold solder joints on the trailing terminals of the devices, as these are blocked from full expo-

sure to the solder by the body of the capacitor.

Restrictions in chip alignment do not apply to SOLDER REFLOW or VAPOR PHASE processes, where the solder volume is con-

trolled by the solder paste deposition on the circuit pads. Pads are designed to match or slightly exceed the width of the capac-

itor, with length .030” (.760 mm) greater than the chip terminal band width, to provide a wetting area for a full solder fillet.

SOLDER ATTACHMENT RECOMMENDED PROFILES

250

225

200

175

150

125

100

75

50

20 40 60 80 100 120 140 160 180 200

SECONDS

SOLDER WAVE

VAPOR PHASE

SOLDER REFLOW

RECOMMENDATIONS

Preheat/Cooling rates not to exceed 120°C/minute.

DT spikes to max temperature not to exceed 100°C

NOVACAP publishes a

Technical Brochure which pro-

vides detailed information on the

properties of ceramic chip

capacitors, dielectric behavior,

product classifications, test and

quality standards, and other

information relevant to their

use. The NOVACAP Technical

Brochure is available upon

request. For quick reference

see the Brochure on the

NOVACAP Website at

www.novacap.com.

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