STD10NF06L-T4 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
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STD10NF06L-T4 Datasheet PDF : 7 Pages
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STD10NF06L
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
5
Rthj-amb Thermal Resistance Junction-ambient Max
100
Tl
Maximum Lead Temperature For Soldering Purpose
275
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS Drain-source
ID = 250 µA, VGS = 0
60
V
Breakdown Voltage
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating, TC = 125 °C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 15V
±100
nA
ON (1)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS, ID = 250µA
VGS = 10V, ID = 5 A
VGS = 5 V, ID = 5 A
Min.
1
Typ.
0.1
0.12
Max.
0.12
0.14
Unit
V
Ω
Ω
DYNAMIC
Symbol
gfs (1)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS =15 V , ID =10A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
6
346
54
22
Max.
Unit
S
pF
pF
pF
2/7
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