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CX02066DIEWP データシートの表示(PDF) - Conexant Systems

部品番号コンポーネント説明メーカー
CX02066DIEWP 3.3 Volt Laser Driver IC for Applications to 3 Gbps Conexant
Conexant Systems Conexant
CX02066DIEWP Datasheet PDF : 12 Pages
First Prev 11 12
CX02066
3.3 Volt Laser Driver IC for Applications to 3 Gbps
Chip Layout
BARE DIE INFORMATION
GND
VCC
CLK
CLK
VCC
GND
VCC
DIN
DIN
VCC
GND
CEN
ENA
DIS
GND
VCC
OCASET
MODSET
GND
BIASMON
MPCSET
MODMON
FAIL
TCSTART
GND
GND
TCSLOPE
OCA
GND
GND
VCC
Dimensions:
Pad opening 84x84µ
Die Size 1790x1718µ
Pad Centres
BIAS GNDA VCCA
OUTP
OUTN
VCCA GNDA GNDA
PD
PIN
X
Y PIN
X
Y PIN
X
Y PIN
CEN
-727 550 BIAS
ENA
DIS
GND
-727
-727
-727
440
330
220
GNDA
VCCA
*OUTP
BIASMON
MODMON
FAIL
-727
-727
-727
110 *OUTP
0 *OUTN
-110 *OUTN
GND
-727 -220 VCCA
OCA
-727 -330 GNDA
GND
-727 -440 GNDA
VCC
-727 -550 PD
* SINGLE PAD/DOUBLE BOND
ADVANCED INFORMATION - REV FF
-550 -711 VCC
727 -550 GND
-440 -711 CMPC
727 -440 VCC
-330 -711 GND
727 -330 DIN
-210 -711 TCSLOPE 727 -220 DIN
-210 -711 GND
727 -110 VCC
100 -711 TCSTART 727
0 GND
100 -711 MPCSET 727 110 VCC
220 -711 GND
727 220 CLK
330 -711 MODSET
440 -711 OCASET
550 -711 VCC
727 330 CLK
727 440 VCC
727 550 GND
PAGE -11-
C
MPC
VCC
X
Y
550 711
440 711
330 711
220 711
110 711
0 711
-110 711
-220 711
-330 711
-440 711
-550 711
CX02066
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