ST14C02C-S24 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

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ST14C02C-S24

Memory Card IC 2 Kbit (256 x 8) Serial I2C Bus EEPROM

STMicroelectronics 

Table 10. Ordering Information Scheme

Example:

ST14C02C - D20

ST14C02C

Delivery Form

D15 Module on Super 35 mm film

D20 Module on Super 35 mm film

W2 Unsawn wafer (275 µm ± 25 µm thickness)

W4 Unsawn wafer (180 µm ± 15 µm thickness)

S2x Sawn wafer (275 µm ± 25 µm thickness)

S4x Sawn wafer (180 µm ± 15 µm thickness)

where “x” indicates the sawing orientation, as follows (and as shown in Figure 11)

1 GND at top right

2 GND at bottom right

3 GND at bottom left

4 GND at top left

Figure 11. Sawing Orientation

GND

ORIENTATION

1

VIEW: WAFER FRONT SIDE

GND

2

GND

3

GND

4

AI02171

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