SKTD View Datasheet(PDF) - ALPS ELECTRIC CO.,LTD.
Part Name
Description
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SKTD Datasheet PDF : 3 Pages
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TACT SwitchTM Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at solder joints
（copper foil surface）.
A heat resistive tape should be used to fix thermocouple.
2. Temperature profile
Temperature (˚C )
180
150
260˚C max. 3 sec max.
230˚C
120 sec max.
（pre-heating）
3 to 4min.
Time inside soldering equipment
Time
40s max.
Notes
1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature greatly
differs from that of the switch, depending on the material, size, thickness of PC boards and others.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines.
Prior verification of soldering condition is highly recommended.
Conditions for Auto-dip
Available for Snap-in Type and Radial Type.
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 100℃ max.
Preheating time
60s max.
Soldering temperature
260℃ max.
Duration of immersion
5s max.
Number of soldering
2times max.
SKHH, SKPD Series
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 110℃ max.
Preheating time
60s max.
Soldering temperature
260℃ max.
Duration of immersion
5s max.
Number of soldering
2times max.
Manual Soldering
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
350℃ max.
3s max.
60W max.
SKHH, SKHW, SKRG, SKPD Series
Items
Condition
Soldering temperature
360℃ max.
Duration of soldering
3s max.
Capacity of soldering iron
60W max.
SKTD, SKTG, SKQJ, SKQK, SKEG Series
Items
Condition
Soldering temperature
350℃ max.
Duration of soldering
3s max.
Capacity of soldering iron
20W max.
SKQJ, SKQK, SKEG Series
Items
Condition
Flux built-up
Mounting surface should not be exposed to flux
Preheating temperature Ambient temperature of the soldered surface of PC board. 100℃ max.
Preheating time
45s max.
Soldering temperature
255℃ max.
Duration of immersion
5s max.
Number of soldering
2times max.
Notes
1. Prevent flux penetration from the top side of the TACT SwitchTM.
2. Switch terminals and a PC board should not be coated with flux prior to soldering.
3. The second soldering should be done after the switch is stable with normal temperature.
4. Use the flux with a specific gravity of min 0.81.
（EC-19S-8 by TAMURA Corporation, or equivalents.）
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