Philips Semiconductors
UHF power LDMOS transistor
PACKAGE OUTLINE
Flanged LDMOST ceramic package; 2 mounting holes; 2 leads
Preliminary speciļ¬cation
BLF1048
SOT502A
D
A
F
3
D1
U1
B
q
C
c
1
L
H U2
A
2
b
p
E1
E
w1 M A M B M
w2 M C M
Q
0
5 10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D D1
E
E1
F
H
L
p
Q
q
U1 U2 w1 w2
mm
4.72 12.83 0.15 20.02 19.96 9.50
3.99 12.57 0.08 19.61 19.66 9.30
9.53
9.25
1.14 19.94 5.33
0.89 18.92 4.32
3.38
3.12
1.70
1.45
27.94
34.16
33.91
9.91
9.65
0.25
0.51
inches
0.186
0.157
0.505 0.006
0.495 0.003
0.788 0.786
0.772 0.774
0.374 0.375
0.366 0.364
0.045 0.785
0.035 0.745
0.210 0.133
0.170 0.123
0.067
0.057
1.100
1.345 0.390
1.335 0.380
0.01
0.02
OUTLINE
VERSION
IEC
SOT502A
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-10-13
99-12-28
2000 Feb 02
4