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ST-5EMR View Datasheet(PDF) - Vishay Semiconductors

Part Name
Description
View to exact match
ST-5EMR
Vishay
Vishay Semiconductors Vishay
ST-5EMR Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
Surface Mount Cermet Trimmers (14 turns)
ST-5
Vishay
MECHANICAL SPECIFICATIONS
Mechanical turn
Operating torque
Mechanical stop
Rotational life
Thrust to shaft
Solderability
Shear (Adhesion)
Substrate bending
Pull-off strength
14 turns
20 mN m {204 gf cm} maximum
Clutch action
200 cycles
10 Ω ∼ 200 Ω [ΔR/R ≤ ± (0.5 Ω + 3 %]
500 Ω ∼ 2 MΩ [ΔR/R ≤ ± (0.5 Ω + 2 %]
5 N {0.51 kgf} minimum
Sn-Pb: 235 °C, 2 s
Sn (Lead-free): 245 ± 3 °C, 2 3 s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10 s
ELECTRICAL CHARACTERISTICS
Nominal resistance
range
10 Ω ∼ 2 MΩ
Resistance tolerance
Power ratings
Resistance law
± 10 %
0.25 W (85 °C) 0 W (120 °C)
Linear law (B)
Maximum input
voltage
DC200 V or power rating, whichever is
smaller
Maximum wiper
current
100 mA or power rating, whichever is
smaller
Effective electrical turn
11 turns
End resistance
1 % or 2 Ω, whichever is greater
C.R.V.
1 % or 3 Ω, whichever is greater
Operating temp. range
- 55 120°C
Temp. coefficient
10 Ω ∼ 50 Ω: ± 250 10-6 /°C maximum
100 Ω ∼ 2 MΩ: ± 100 10-6 /°C maximum
Insulation resistance
1000 MΩ minimum (DC500 V)
Dielectric strength
AC600 V, 60 s
Net weight
Approx. 0.35 g
Reflow profile for soldering heat evaluation
(°C)
250
200
180 °C
150 150 °C
100
Peak
:
250
+5
0
°C
Over 230 °C
Pre Heating Zone
90 ± 30 s
30 ± 10 s
50
Heating time Soldering Zone
Reflow : two times maximum
ENVIRONMENTAL SPECIFICATIONS
Test item
Thermal shock
Humidity
Shock
Test conditions
- 65 125 °C (0.5 h),
5 cycles
- 10 65 °C (Relative
humidity 80 98 %),
10 cycles, 240 h
981 m/s2, 6 ms
6 directions for 3 times
each
Specifications
[ΔR/R 2 %]
[S.S. 1 %]
[ΔR/R 2 %]
Vibration
Load Life
Amplitude 1.52 mm or
Acceleration 196 m/s2,
10 2000 Hz,
3 directions, 12 times
each
85 °C, 0.25 W, 1000 h
[ΔR/R 1%]
[S.S. 1 %]
[ΔR/R 3 %]
[S.S. 1 %]
Low
temperature
operation
- 55 °C, 2 h
[ΔR/R 2 %]
[S.S. 2 %]
High
temperature
exposure
Immersion seal
120 °C, 250 h
[ΔR/R 3 %]
[S.S. 2 %]
85 °C, 60 s
Sn-Pb
260 °C, 10 s or 215 °C,
35 s
No leaks (No
continuous bubbles)
Soldering heat
Sn
Flow: 260 °C ± 3 °C as
the temperature in a pot
of molten solder,
immersion from head of
terminal to backside of
board, 5 6 s, two times
maximum
Reflow: Peak
temperature 255 °C
(Please refer to the
profile below.)
Manual soldering:
350 ± 10 °C, 3 4 s
[ΔR/R 1 %]
Document Number: 58011
Revision: 06-Mar-06
For technical questions contact: copalsupport@vishay.com
www.vishay.com
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