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MC74LCX125DTEL View Datasheet(PDF) - ON Semiconductor

Part Name
Description
View to exact match
MC74LCX125DTEL
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74LCX125DTEL Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MC74LCX125
PACKAGE DIMENSIONS
TSSOP
CASE 948G–01
ISSUE O
0.15 (0.006) T U S
2X L/2 14
L
PIN 1
IDENT.
1
14X K REF
0.10 (0.004) M T U S V S
8
B
–U–
7
N
0.25 (0.010)
M
N
F
DETAIL E
0.15 (0.006) T U S
A
–V–
K
J J1 ÇÇÉÉÇÇK1ÉÉÇÇ
SECTION N–N
C
0.10 (0.004)
–T– SEATING
PLANE
D
G
H
DETAIL E
NOTES:
ąă1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ąă2. CONTROLLING DIMENSION: MILLIMETER.
ąă3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ąă4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
ąă5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
ąă6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
ąă7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
–W–
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G
0.65 BSC
0.026 BSC
H 0.50 0.60 0.020 0.024
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L
6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
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8
MC74LCX125/D
 

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