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FDS3601 View Datasheet(PDF) - Fairchild Semiconductor

Part Name
Description
View to exact match
FDS3601
Fairchild
Fairchild Semiconductor Fairchild
FDS3601 Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Drain-Source Avalanche Ratings (Note 2)
WDSS
Drain-Source Avalanche Energy Single Pulse, VDD = 50 V, ID= 1.3 A
IAR
Drain-Source Avalanche Current
Off Characteristics
BVDSS
BVDSS
TJ
IDSS
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
VGS = 0 V, ID = 250 µA
100
ID = 250 µA,Referenced to 25°C
VDS = 80 V, VGS = 0 V
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V, VDS = 0 V
IGSSR
Gate–Body Leakage, Reverse
VGS = –20 V, VDS = 0 V
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
2
ID = 250 µA,Referenced to 25°C
VGS = 10 V,
ID = 1.3 A
VGS = 6 V,
ID = 1.3 A
VGS = 10 V, ID = 1.3 A, TJ = 125°C
VGS = 10 V,
VDS = 10 V
3
VDS = 5V,
ID = 1.3 A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 50 V,
f = 1.0 MHz
V GS = 0 V,
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = 50 V,
VGS = 10 V,
ID = 1 A,
RGEN = 6
VDS = 50 V,
VGS = 10 V
ID = 1.3 A,
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 1.3 A (Note 2)
26
mJ
1.3
A
V
105
mV/°C
10
µA
100 nA
–100 nA
2.6
4
V
–5
mV/°C
350 480 m
376 530
664 955
A
3.6
S
153
pF
5
pF
1
pF
8
16
ns
4
8
ns
11 20
ns
6
12
ns
3.7
5
nC
0.8
nC
1
nC
1.3
A
0.8 1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 78°C/W when
mounted on a
0.5in2 pad of 2
oz copper
b) 125°C/W when
mounted on a
0.02 in2 pad of
2 oz copper
c) 135°C/W when
mounted on a
minimum pad.
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS3601 Rev C(W)
 

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