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HI-506A View Datasheet(PDF) - Renesas Electronics

Part Name
Description
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HI-506A Datasheet PDF : 20 Pages
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HI-506A, HI-507A, HI-508A, HI-509A
Ordering Information
PART
NUMBER
PART MARKING
TEMP. RANGE (°C)
PACKAGE
PKG. DWG. #
HI1-0506A-2
HI1-506A-2
-55 to +125
28 Ld CERDIP
F28.6
HI1-0506A-5
HI1-506A-5
0 to +75
28 Ld CERDIP
F28.6
HI1-0506A-8
HI1-506A-8
-55 to +125
+ 160 Hour Burn-In
28 Ld CERDIP
F28.6
HI3-0506A-5
HI3-506A-5
0 to +75
28 Ld PDIP
E28.6
HI3-0506A-5Z (Note 1)
HI3-506A-5Z
0 to +75
28 Ld PDIP (Note 2) (Pb-free) E28.6
HI3-0507A-5
HI3-507A-5
0 to +75
28 Ld PDIP
E28.6
HI3-0507A-5Z (Note 1)
HI3-507A-5Z
0 to +75
28 Ld PDIP (Note 2) (Pb-free) E28.6
HI1-0508A-8
HI1-508A-8
-55 to +125
+ 160 Hour Burn-In
16 Ld CERDIP
F16.3
HI3-0508A-5
HI3-508A-5
0 to +75
16 Ld PDIP
E16.3
HI3-0508A-5Z (Note 1)
HI3-508A-5Z
0 to +75
16 Ld PDIP (Note 2) (Pb-free) E16.3
HI1-0509A-2
HI1-509A-2
-55 to +125
16 Ld CERDIP
F16.3
HI1-0509A-5
HI1-509A-5
0 to +75
16 Ld CERDIP
F16.3
HI1-0509A-8
HI1-509A-8
-55 to +125
+ 160 Hour Burn-In
16 Ld CERDIP
F16.3
HI3-0509A-5
HI3-509A-5
0 to +75
16 Ld PDIP
E16.3
HI3-0509A-5Z (Note 1)
HI3-509A-5Z
0 to +75
16 Ld PDIP (Note 2) (Pb-free) E16.3
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC
J STD-020.
2. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN3143 Rev.6.00
October 30, 2007
Page 2 of 20
 

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