232ECBNZ View Datasheet(PDF) - Renesas Electronics
Part Name
Description
View to exact match
232ECBNZ Datasheet PDF : 23 Pages
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HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
123
-A-
D
SEATING PLANE
A
L
h x 45o
-C-
a
e
A1
C
B
0.10(0.004)
0.25(0.010) M C A M B S
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.0926 0.1043 2.35
2.65
-
A1
0.0040 0.0118 0.10
0.30
-
B
0.013 0.0200 0.33
0.51
9
C
0.0091 0.0125 0.23
0.32
-
D
0.6969 0.7125 17.70 18.10
3
E
0.2914 0.2992 7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394 0.419 10.00 10.65
-
h
0.01
0.029 0.25
0.75
5
L
0.016 0.050 0.40
1.27
6
N
28
28
7
0o
8o
0o
8o
-
Rev. 1, 1/13
TYPICAL RECOMMENDED LAND PATTERN
(1.50mm)
(9.38mm)
(1.27mm TYP)
(0.51mm TYP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
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FN4315 Rev 17.00
September 14, 2015
Page 23 of 23
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