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HIN202ECBNZ View Datasheet(PDF) - Renesas Electronics

Part Name
Description
View to exact match
HIN202ECBNZ Datasheet PDF : 23 Pages
First Prev 21 22 23
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Package Outline Drawing
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 2, 3/11
24
INDEX
AREA
7.60 (0.299)
7.40 (0.291) 10.65 (0.419)
10.00 (0.394)
123
TOP VIEW
15.60 (0.614)
15.20 (0.598)
1.27 (0.050)
0.51 (0.020)
0.33 (0.013)
SIDE VIEW “A”
DETAIL "A"
SEATING PLANE
2.65 (0.104)
2.35 (0.093)
0.30 (0.012)
0.10 (0.004)
1.27 (0.050)
0.40 (0.016)
0.75
0.25
(0.029)
(0.010)
x
45°
0.32 (0.012)
0.23 (0.009)
SIDE VIEW “B”
1.981 (0.078)
9.373 (0.369)
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. Package length does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
3. Package width does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm
(0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions in
( ) are not necessarily exact.
8. This outline conforms to JEDEC publication MS-013-AD ISSUE C.
1.27 (0.050)
0.533 (0.021)
TYPICAL RECOMMENDED LAND PATTERN
FN4315 Rev 17.00
September 14, 2015
Page 21 of 23
 

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