3KP13A View Datasheet(PDF) - JIEJIE MICROELECTRONICS CO.,Ltd
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3KP13A Datasheet PDF : 5 Pages
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3000W 3KP Series
JieJie Microelectronics CO. , Ltd
RATINGS AND V-I CHARACTERISTICS CURVES (TA=25ºC, unless otherwise noted)
FIG.1:V- I curve characteristics
(U n i-d ire c tio n a l)
FIG.2:V- I curve characteristics
(Bi-directional)
IPP
VC VBR VR
V
VF
VC VBR VR
IT
IR
IR
IT
V
VR VBR VC
IPP
IPP
FIG.3: Pulse waveform
IPPM(%IRSM)
150
tr=10μs
tr = rise time to peak value
td = decay time to half value
100 Peak value
Half value
50
td
t(ms)
0
0
1.0
2.0
3.0
4.0
FIG.4: Pulse derating curve
PPP derating in percentage(%)
100
80
60
40
20
0
TA(℃)
0
25 50 75 100 125 150 175
SOLDERING PARAMETERS
Reflow Condition
Pre
Heat
-Temperature Min (Ts(min))
-Temperature Max(Ts(max))
-Time (Min to Max) (ts)
Average ramp up rate (Liquid us Temp
(TL) to peak)
Ts(max) to TL - Ramp-up Rate
Reflow
-Temperature(TL)(Liquid us)
-Temperature(tL)
Peak Temp (Tp)
Time within 5℃ of actual Peak Temp (tp)
Ramp-down Rate
Time 25℃ to Peak Temp (TP)
Do not exceed
Pb-Free assembly
(see FIG.5)
+150℃
+200℃
60-180 secs.
3℃/sec. Max
3℃/sec. Max
+217℃
60-150 secs.
+260(+0/-5)℃
30 secs. Max
6℃/sec. Max
8 min. Max
+260℃
FIG.5: Reflow condition
TP
TL
TS(max)
Ramp-up
TS(min)
Preheat
ts
tp
Critical Zone
TL to TP
tL
Ramp-down
25
time to peak temperatue
(t 25℃ to peak)
Time
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