|IAA110P||Integrated Telecom Circuits|
|IAA110P Datasheet PDF : 6 Pages |
INTEGRATED CIRCUITS DIVISION
0.635 X 45°
(0.025 X 45°)
PCB Land Pattern
See Note 3
Lead to Package Standoff:
MIN: 0.0254 (0.001)
MAX: 0.102 (0.004)
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating
(1000 microinch maximum).
3. Sum of package height, standoff, and coplanarity
does not exceed 2.108 (0.083).
IAA110PTR Tape & Reel
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
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