TEA1530AP View Datasheet(PDF) - NXP Semiconductors.

Part Name

Description

View to exact match

TEA1530AP

GreenChip II SMPS control IC

NXP Semiconductors. 

NXP Semiconductors

12. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

TEA1530T/AT/AP

GreenChip II SMPS control IC

SOT96-1

D

y

Z

8

c

5

E

A

X

HE

vM A

pin 1 index

1

e

A2

A1

4

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

c

D(1) E(2)

e

HE

L

Lp

Q

v

w

y

Z (1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 11. Package outline SOT96-1 (SO8)

TEA1530T_AT_AP_1

Product data sheet

Rev. 01 — 30 June 2008

© NXP B.V. 2008. All rights reserved.

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