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G1117T61B View Datasheet(PDF) - Global Mixed-mode Technology Inc

Part Name
Description
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G1117T61B
GMT
Global Mixed-mode Technology Inc GMT
G1117T61B Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Global Mixed-mode Technology Inc.
G1117
Absolute Maximum Ratings
(Note 1)
Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . .150°C
Reflow Temperature (soldering, 10sec) . . . . . . 260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . .116°C/W
Thermal Resistance Junction to Case, (θJc)
SOT-223 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21°C/W
Operating Conditions
(Note 1)
(VIN-VADJ) Voltage. . . . . . . . . . . . . . . . . . . . . .2.5V~6.5V
Temperature Range. . . . . . . . . . . . . .-40°C TA 85°C
Note (1): See Recommended Minimum Footprint
Electrical Characteristics
Operating Conditions: VIN 6.5V, TJ = 25°C unless otherwise specified. [Note3]
PARAMETER
CONDITIONS
Reference Voltage
Line Regulation
Load Regulation
Dropout Voltage
Current Limit
Adjust Pin Current Change
Minimum Load Current
Quiescent Current
Ripple Rejection
Thermal Regulation
Temperature Stability
RMS Output Noise (% of VOUT)
Thermal Resistor Junction-to-Ambient
(No heat sink; No air flow)
VIN - VOUT = 2V, IOUT = 10mA
(VOUT + 1.5V) < VIN < 6.5V, IOUT = 10mA
(VIN - VOUT) = 2V, 10mA < IOUT < 1A
ΔVOUT = 2%, IOUT = 800mA
ΔVOUT = 2%, IOUT = 1A
(VIN - VOUT) = 2V
VIN - VOUT = 2V, 10mA < IOUT < 1A
1.5V < (VIN - VOUT) < 5.25V
VIN - VOUT = 2V
f = 120Hz, COUT = 10μF Tantalum,
(VIN - VOUT) = 3V, IOUT = 800mA
TA = 25°C, 30ms pulse
VIN = 4V, IO =10mA
TA = 25°C, 10Hz < f < 10kHz, ILOAD = 10mA
SOT-223; Recommended Minimum Footprint
Thermal Shutdown
Junction Temperature
Thermal Shutdown Hysteresis
MIN
1.225
---
---
---
---
1000
---
10
30
---
---
---
---
---
---
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TYP
1.250
1.32
0.04
1.2
1.3
1200
0.15
---
80
50
0.004
0.3
0.007
116
150
10
MAX
1.275
---
---
1.3
1.4
---
---
---
150
UNITS
V
%
%
V
mA
µA
mA
µA
---
dB
0.02 %/W
---
%
---
%
--- °C/W
---
°C
---
°C
Note1:
Note2:
Note3:
Note4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G1117 in SOT-223 package; θJA is 116°C/W (See recommend minimum footprint).
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Ver: 1.9
Mar 07, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
2
 

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