Glass passivated chip junction in DO-201 package.
1,500W surge capability at 10/1000μs waveform.
Excellent clamping capability.
Low zener impedance.
Fast response time: typically less than 1.0ps from 0 volt to BV min.
Typical IR less than 1μA above 10V.
High temperature soldering guaranteed: 265ć/10 seconds/.375”,
(9.5mm) lead length, 5lbs., (2.3kg) tension.
Case: JEDEC DO-201 Molded Plastic.
Terminals: Axial leads, solderable per MIL-STD-750, Method 2026.
Polarity: Color band denotes cathode except Bipolar.
Mounting Position: Any.
Weight: 0.045 ounce, 1.2 grams.
DDEVICES FOR BIPOLAR APPLICATION
For Bidirectional, use C or CA suffix for type 1.5KE6.8 through type 1.5KE550 (e.g.1.5KE6.8C, 1.5KE550CA);
Electrical characteristics apply in both directions.
MMAXIMUM RATINGS AND CHARACTERISTICS
Ratings at 25ć ambient temperature unless otherwise specified.
Peak Pulse Power Dissipation on 10/1000ȝs waveform. (Note 1ˈFig. 1)
Peak Pulse Current on 10/1000ȝs waveform. (Note 1ˈFig. 3)
Steady State Power Dissipation at TL =75ćˈLead length .375” (9.5mm).
Peak Forward Surge Currentˈ8.3ms Single Half Sine-Wave Superimposed
on Rated Load. (JEDEC Method) (Note 2, Fig. 6)
Operating junction and Storage Temperature Range.
TJ , TSTG
-55 to +175
Notes: 1. Non-repetitive current pulse, per Fig. 3 and derated above TA = 25ć per Fig. 2.
2.28.3ms single half sine-wave, or equivalent square wave, Duty cycle = 4 pulses per minute maximum.
All specifications are subject to change without notice.