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STP08CP05(2008) View Datasheet(PDF) - STMicroelectronics

Part Name
Description
View to exact match
STP08CP05
(Rev.:2008)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STP08CP05 Datasheet PDF : 27 Pages
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STP08CP05
10 Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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