datasheetbank_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

ST-32EA View Datasheet(PDF) - Unspecified

Part Name
Description
View to exact match
ST-32EA Datasheet PDF : 6 Pages
1 2 3 4 5 6
ST-32
SURFACE MOUNT TRIMMERS
LIST OF PART NUMBERS
Adjustment Shape of
position terminal
Form of packaging
Taping (reel)
Plastic bag
Top
adjustment
A (J-hook)
B (Gull wing)
Side
adjustment
G (J-hook)
H (Gull wing)
Pieces in package
ST-32ETA
ST-32ETB
ST-32ETG
ST-32ETH
500 pcs./reel
ST-32EA
ST-32EB
ST-32EG
ST-32EH
100 pcs./pack
ELECTRICAL CHARACTERISTICS
Nominal resistance range
Resistance tolerance
Power ratings
Resistance law
Maximum input voltage
Maximum wiper current
Effective electrical angle
End resistance
C.R.V.
Operating temp. range
Temp. coefficient
Insulation resistance
Dielectric strength
Net weight
10 Ω ~ 2 MΩ
± 20 %
0.125 W (70 °C) 0 W (125 °C)
Linear law (B)
DC200 V or power rating, whichever is smaller
100 mA or power rating, whichever is smaller
210 ° (1 turn)
1 % or 2 Ω, whichever is greater
1 % or 3 Ω, whichever is greater
55 ~ 125 °C
10 Ω ~ 50 Ω : ± 250 10-6/°C maximum
100 Ω ~ 2 MΩ : ± 100 10-6/°C maximum
1000 MΩ minimum (DC500 V)
AC500 V, 60 s
Approx. 0.05 g (ST-32EA, EB)
Approx. 0.11 g (ST-32EG, EH)
Reflow profile for soldering heat evaluation
(C)
250
200
180 C
150 150 C
100
50
Peak
:
250
+5
0
C
Over 230 C
Pre Heating Zone
90 30 s
30 10 s
Heating time Soldering Zone
Reflow : two times maximum
Nominal resistance values
A 10 Ω
1 kΩ
50 kΩ
A 20 Ω
2 kΩ
100 kΩ
50 Ω
3 kΩ
200 kΩ
100 Ω
5 kΩ
500 kΩ
200 Ω
10 kΩ
1 MΩ
300 Ω
20 kΩ
2 MΩ
500 Ω
30 kΩ
Fig.1
The products indicated by A mark are manufactured upon receipt of order basis.
The part numbers on the left are all available with the respective combination of
<Nominal resistance values> (Fig. 1).
Verify the above part numbers when placing orders.
Taping specification is not sold separately and must be purchased in reel units.
MECHANICAL CHARACTERISTICS
Mechanical angle
Operating torque
Stop strength
Rotational life
Thrust to rotor
Solderability
Shear (Adhesion)
Substrate bending
Pull-off strength
250 ° (1 turn)
5 mN·m {51 gf·cm} maximum
20 mN·m {204 gf·cm} minimum
100 cycles [ΔR/R ± (2 Ω + 3 %)]
5 N {0.51 kgf} minimum
245 ± 3 °C, 2 ~ 3 s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10 s
{ }Reference only
ENVIRONMENTAL CHARACTERISTICS
Test item
Test conditions
Specifications
Thermal shock
Humidity
Shock
Vibration
Load life
65 ~ 125 °C (0.5 h), 5 cycles
10 ~ 65 °C ,
10 cycles, 240 h
981 m/s2, 6 ms
6 directions for 3 times each
(Amplitude) 1.52 mm or
(Acceleration) 196 m/s2,
10 ~ 2000 Hz, 3 directions, 12 times each
70 °C, 0.125 W, 1000 h
Low temp. operation
55 °C, 2 h
High temp. exposure
125 °C, 250 h
[ΔR/R 2 %]
[S.S. 1 %]
[ΔR/R 2 %]
[ΔR/R 1 %]
[S.S. 1 %]
[ΔR/R 3 %]
[S.S. 1 %]
[ΔR/R 2 %]
[S.S. 2 %]
[ΔR/R 3 %]
[S.S. 2 %]
Immersion seal
85 °C, 60 s
No leaks (No continuous bubbles)
Soldering heat
Flow : 260 ± 3 °C as the temperature in a pot of
molten solder, immersion from head of terminal
to backside of board, 5 ~ 6 s, two times
maximum.
Reflow : Peak temperature 255 °C
(Please refer to the profile below.)
Manual soldering350 ± 10 °C, 3 ~ 4 s
[ΔR/R 1 %]
ΔR/RChange in total resistance
S.S. Setting stability
 

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]