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BCX52(2008) View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
View to exact match
BCX52
(Rev.:2008)
NXP
NXP Semiconductors. NXP
BCX52 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
NXP Semiconductors
BCP52; BCX52
60 V, 1 A PNP medium power transistors
1.6
Ptot
(W)
1.2
(1)
0.8
(2)
0.4
006aaa220
1.6
Ptot
(W)
(1)
1.2
(2)
0.8
(3)
0.4
006aaa221
0
75
25 0 25
75
125
175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 1 cm2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
0
75
25 0 25
75
125
175
Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 2. Power derating curves SOT89
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
BCP52
Conditions
in free air
BCX52
Rth(j-sp)
thermal resistance from
junction to solder point
BCP52
BCX52
Min Typ Max Unit
[1] -
-
190 K/W
[2] -
-
125 K/W
[1] -
-
230 K/W
[2] -
-
135 K/W
[3] -
-
95
K/W
-
-
17
K/W
-
-
20
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
BCP52_BCX52_8
Product data sheet
Rev. 08 — 25 February 2008
© NXP B.V. 2008. All rights reserved.
4 of 12
 

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