APM3095P View Datasheet(PDF) - Anpec Electronics

Part Name

Description

View to exact match

APM3095P

P-Channel Enhancement Mode MOSFET

Anpec Electronics 

APM3095P

Physical Specifications

Terminal Material

Lead Solderability

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb)

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition (IR/Convection or VPR Reflow)

Reference JEDEC Standard J-STD-020A APRIL 1999

Pre-heat temperature

183°C

Peak temperature

Time

Classification Reflow Profiles

Average ramp-up rate(183°C to Peak)

Preheat temperature 125 ± 25°C)

Temperature maintained above 183°C

Time within 5°C of actual peak

temperature

Peak temperature range

Ramp-down rate

Time 25°C to peak temperature

Convection or IR/ Convection

3°C/second max.

120 seconds max.

60 ~ 150 seconds

10 ~ 20 seconds

VPR

10 °C /second max.

60 seconds

220 +5/-0°C or 235 +5/-0°C

6 °C /second max.

6 minutes max.

215~ 219°C or 235 +5/-0°C

10 °C /second max.

Package Reflow Conditions

pkg. thickness ≥ 2.5mm

and all bags

Convection 220 +5/-0 °C

VPR 215-219 °C

IR/Convection 220 +5/-0 °C

pkg. thickness < 2.5mm and

pkg. volume ≥ 350 mm³

pkg. thickness < 2.5mm and pkg.

volume < 350mm³

Convection 235 +5/-0 °C

VPR 235 +5/-0 °C

IR/Convection 235 +5/-0 °C

Copyright  ANPEC Electronics Corp.

7

Rev. A.1 - Oct., 2002

www.anpec.com.tw

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