SL23 View Datasheet(PDF) - Analog Devices
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SL23 Datasheet PDF : 28 Pages
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ADP2300/ADP2301
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN
SW
BST to SW
BST
FB
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +28 V
−1.0 V to +28 V
−0.6 V to +6 V
−0.3 V to +28 V
−0.3 V to +3.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to GND.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance1
Package Type
θJA
6-Lead TSOT
186.02
θJC
66.34
Unit
°C/W
1 θJA and θJC are measured using natural convection on a JEDEC 4-layer board.
ESD CAUTION
Rev. 0 | Page 4 of 28
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